ASHRAE TC 9.9 · NFPA 70B
Thermal, airflow and pressure mapping for data centres
Find hot spots, bypass air and pressure problems before they cost cooling capacity or equipment. Includes IR thermography of electrical panels, plus lux and noise surveys for occupied areas.
What a thermal and airflow survey finds
Most data halls are overcooled on average and undercooled in specific places. The BMS reports return air temperature at the CRAH, which says little about what a server at the top of rack 14 is breathing. A rack-level survey shows where cold air is wasted and where hot air is coming back.
- Rack inlet mapping at bottom, middle and top of each rack, against the ASHRAE envelope
- Perforated tile airflow in CFM using a capture hood, compared with the rack load it serves
- Under-floor static pressure and room differential pressure to corridors and adjacent rooms
- Hot aisle and cold aisle containment leak checks
- IR thermography of LT panels, bus ducts, PDUs, UPS and battery strings, with a severity rating for each anomaly
- Lux and noise in data halls, plant rooms and offices, for safe working and statutory records
Thermography severity guide
Temperature rise of a component compared with a similar component under the same load. We report the measured ΔT, load at time of test and the recommended action.
| ΔT over similar component | Severity | Recommended action |
|---|---|---|
| 1 to 3 °C | Possible deficiency | Monitor at next scheduled survey |
| 4 to 15 °C | Probable deficiency | Repair at next planned shutdown |
| > 15 °C | Major discrepancy | Repair immediately |
Based on ANSI/NETA MTS temperature-rise guidance. Final priorities are set with your electrical team and the equipment manufacturer.